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Our Company's two papers are lectured at the fourth National Youth Printed Circuit Academic Annual M

Date£º2017-08-26  View£º3145

Recently, Selection of Using Rigid-flex PCB Filling Method to Produce Infill Board and CCL Research respectively written by Li Tonglin, Vice General Manager of FPC Division, Chen Yilong and Huang Xianquan from Technology R&D Center were invited to give keynote speech at the fourth National Youth Printed Circuit Academic Annual Meeting


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